Tiny Size Uncooled Infrared Camera Core 640x512 12um for UAV
Payloads
Product Description
As a leading manufacturer of cooled uncooled infrared detectors &
thermal modules, Global Technology developes a tiny size and
lightweight infrared thermal imaging core iTL612R Pro, which is the
compact version of infrared camera core iTL612R.
Fully oriented for SWaP-C (size-weight-and- power-cost), the size
and weight of iTL612R Pro infrared camera core has already been at
the forefront in the industry.It is the best choice for customers who have restrict requirements
on size and weight when integrating their own drones.
Providing 640×512/12μm self-developed wafer-level infrared
detector, lens protection grade IP67, imaging and temperature
measurement version, and various SDK solutions, the iTL612R Pro
thermal module responds to space constraints with smaller size and
lighter weight, achieves longer battery life with lower power
consumption, overcomes integration problems in the consumer
electronics field, and provides more solutions for compact and
portable products.
It is specially developed for the field of Predictive Maintenance,
Photovoltaic Inspection, Environmental Protection, Scientific
Research, Aerial Photography, Police Investigation, Disaster Relief
& Rescue, Forest Fire Prevention, Urban Safety etc.
Main Features
Compact & Lightweight Design
• Size: 17mm×17mm×22mm (with 9.1mm lens)
• Weight: 13g (with 9.1mm lens)
• Power consumption as low as 0.7W
Clear Image & Accurate Radiometry
• Brand new image process algorithm: NUC/3DNR/DNS/DRC/EE
• Support Windows/Linux/ARM SDK
• Support regional, point & isotherm temperature measurement
Various Interfaces for Easy Integration
• DVP/LVDS/USB2.0 interfaces, RAW/YUV image data output, serial
port control
Product Specifications
| Model | iTL612R Pro |
| IR Detector Performance |
| Sensitive Material | Vanadium Oxide |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Range | 8~14μm |
| Typical NETD | ≤40mk |
| Image Processing |
| Frame Rate | 30Hz |
| Start-up Time | 5s |
| Digital Video | RAW/YUV/BT656 |
| Image Algorithm | Non-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
De-noise (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE) |
| Image Display | Black Hot/White Hot/Pseudo Color |
| PC Software |
| ICC Software | Module Control & Video Display |
| Electrical Specifications |
| Standard External Interface | 30Pin_HRS: DF40C-30DP-0.4V(51), (HRS, Male) |
| USB Expansion Board | Type-C |
| Communication Interface | RS232-TTL/USB2.0 |
| Digital Video Interface | CMOS8/USB2.0 |
| Supply Voltage | 4.0-5.0V V VDC |
| Typical Power Consumption | 0.7W |
| Temperature Measurement |
| Operating Temperature Range | -10°C~+50°C |
| Temperature Measurement Range | -20°C~+150°C, 0°C~550°C; Support Customization and Expansion |
| Temperature Measurement Accuracy | Greater of ±2°C or ±2% (@23℃±3℃) |
| Regional Temperature Measurement | Support Maximum, Minimum and Average Value of the Output Regional
Temperature |
| SDK | Support Windows/Linux/ARM; Achieve Video Stream Analysis and
Conversion from Gray to Temperature |
| Physical Characteristics |
| Size (mm) | 17×17×22 (With 9.1mm Lens) |
| Weight | 13g (With 9.1mm Lens) |
| Environmental Adaptability |
| Operating Temperature | -40°C~+70°C |
| Storage Temperature | -45°C~+85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Certificates | ROHS2.0/REACH |
| Optics |
| Optional Lens | Fixed Focus Athermal: 9.1mm |
Industrial Applications
The iTL612R Pro thermal imaging module can be integrated into UAV
payloads and wearable devices so that is widely used in fields of Predictive Maintenance, Photovoltaic Inspection, Environmental
Protection, Scientific Research, Aerial Photography, Police
Investigation, Relief & Rescue, Forest Fire Prevention, Urban
Safety etc.
Global Sensor Technology
FAQs
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a
mature infrared detector packaging technology. Compared with metal
packaging, the volume and weight of the packaged detector will be
greatly reduced. For ceramic packaging, its readout circuit has
self-adjusting operating temperature function and does not require
TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging,
has become an important part of advanced packaging technology in
the semiconductor industry. Wafer level packaging (WLP) is the
process of completing high vacuum packaging directly on the entire
MEMS wafer, then scribing and cutting to make a single infrared
detector. It performs most or all of the packaging and testing
procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small
size, lightweight, portable, handheld, low price and high
production efficiency.
