PLUG417R Uncooled Thermal Module
400x300 17μM LWIR Thermal Camera Module Uncooled With Industrial
Thermography
Product Description
PLUG417R thermal camera core uses the 400x300 / 17μm uncooled LWIR
infrared detctor with an optional temperature measurement function
with measurement range from -20℃~150 ℃ for industrial or body
temperature measurement. This infrared thermal module can not only
measures the value of temperature around you but also display the
thermal imaging figure. So it must be your best choice to monitor
the temperature change.
This small infrared camera module can be widely used in infrared
thermal imaging applications such as Thermography, Electricity
Power Inspection, Building Inspection etc. It is beneficial to OEM
customers for secondary development and integration in all kinds of
thermal imagers and infrared thermographic cameras.
Main Features
- NETD<30mk, High Sensitivity
- Stable Performance
- Easy Integration
- Clear Image Quality & Details
- Customizable Temperature Range
- Strong Environmental Adaptability
Product Specifications
| Model | PLUG417R |
| IR Detector Performance |
| Resolution | 400x300 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | <30mk |
| Image Processing |
| Frame Rate | 25Hz/30Hz/50Hz/60Hz |
| Start-up Time | <15s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656/LVDS |
| Extension Component | USB/Camerlink |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE |
| Electrical Specification |
| Standard External Interface | 50pin_HRS Interface |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 4.5~6V |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±2°C or ±2% (Take the Maximum Value) |
| SDK | ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 44.5x44.5x36.6 |
| Weight | ≤77g |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 7.5mm/13mm/19mm/25mm/35mm |
Industrial Applications
The PLUG417R thermal camera core is widely used in Electric Power
Inspection, Machine Vision, Building HVAC Security & Monitoring,
Outdoors, Firefighting & Rescue, Law Enforcement & Rescue, ADAS,
UAV Payloads etc.
Praises from Customers
FAQs
1. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging,
has become an important part of advanced packaging technology in
the semiconductor industry. Wafer level packaging (WLP) is the
process of completing high vacuum packaging directly on the entire
MEMS wafer, then scribing and cutting to make a single infrared
detector. It performs most or all of the packaging and testing
procedures directly on the IR detector wafer before dicing. It is
an improved chip size package that meets the needs of small size,
lightweight, portable, handheld, low price and high production
efficiency.
