iTL612/R Thermal Imaging Module
Fast Integration Drone Thermal Camera with Uncooled Infrared
Thermal Detector 640x512 12μm
Product Description
The iTL612R infrared camera core integrates 640x512 / 12μm wafer
level package (WLP) infrared thermal detector. It is an uncooled
LWIR radiometric thermal imaging module for drones with spectral
range from 8 to 14μm.
iTL612 thermal camera module features in sharp and crisp image
presentation, compact size and low cost. Oriented for fully
optimized SWaP, iTL612R uncooled thermal module provides a reliable
solution for infrared system integration with limited space. Its
compact structure has reached top level of the same specification
module. It also has an optional thermographic function with
measurement range from -20℃~550 ℃ for industrial temperature
measurement.
The iTL612 thermal module is specially developed for the field of
Predictive Maintenance, Photovoltaic Inspection, Environmental
Protection, Scientific Research, Aerial Photography, Police
Investigation, Relief & Rescue, Forest Fire Prevention, Urban
Safety etc.
Main Features
Compact & Lightweight Design
• Size: 21mm×22.3mm×27.3mm (with 9.1mm lens)
• Weight: 20.8g±1.5g (with 9.1mm lens)
• Low power consumption as low as 0.7W
Clear Image & Accurate Radiometry
• Brand new image process algorithm: NUC/3DNR/DNS/DRC/EE
• Support Windows/Linux/ARM SDK
• Support regional, point & isotherm temperature measurement
Various Interfaces for Easy Integration
• DVP/LVDS/USB2.0 interfaces, RAW/YUV image data output, serial
port control
Product Specifications
| Model | iTL612/R |
| IR Detector Performance |
| Sensitive Material | Vanadium Oxide |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Range | 8~14μm |
| Typical NETD | ≤40mk |
| Image Processing |
| Frame Rate | 30Hz |
| Start-up Time | 5s |
| Digital Video | RAW/YUV/BT656 |
| Image Algorithm | Non-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
De-noise (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE) |
| Image Display | Black Hot/White Hot/Pseudo Color |
| PC Software |
| ICC Software | Module Control & Video Display |
| Electrical Specifications |
| Standard External Interface | 30Pin_HRS: DF40C-30DP-0.4V(51), (HRS, Male) |
| USB Expansion Board | Type-C |
| Communication Interface | RS232-TTL/USB2.0 |
| Digital Video Interface | CMOS8/USB2.0 |
| Supply Voltage | 3.3V±0.1V VDC |
| Typical Power Consumption | 0.7W |
| Temperature Measurement |
| Operating Temperature Range | -10°C~+50°C |
| Temperature Measurement Range | -20°C~+150°C, 0°C~550°C; Support Customization and Expansion |
| Temperature Measurement Accuracy | Greater of ±3°C or ±3% (@23℃±3℃) |
| Regional Temperature Measurement | Support Maximum, Minimum and Average Value of the Output Regional
Temperature |
| SDK | Support Windows/Linux/ARM; Achieve Video Stream Analysis and
Conversion from Gray to Temperature |
| Physical Characteristics |
| Size (mm) | 21×22.3×27.3 (With 9.1mm Lens) |
| Weight | 20.8g±1.5g (With 9.1mm Lens) |
| Environmental Adaptability |
| Operating Temperature | -40°C~+70°C |
| Storage Temperature | -45°C~+85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Certificates | ROHS2.0/REACH |
| Optics |
| Optional Lens | Fixed Focus Athermal: 9.1mm |
Industrial Applications
The iTL612/R thermal imaging module can be integrated into UAV
payloads and wearable devices so that is widely used in fields of Predictive Maintenance, Photovoltaic Inspection, Environmental
Protection, Scientific Research, Aerial Photography, Police
Investigation, Relief & Rescue, Forest Fire Prevention, Urban
Safety etc.
Global Sensor Technology
FAQs
1. About metal packaging infrared detector
Metal packaging uses metal tube shell, thermoelectric cooler (TEC)
and columnar getter. The TEC plays an important role of stabilizing
the working temperature so that the infrared detector works at room
temperature, thereby improving the ability of thermal imaging
sensors to adapt to extreme environments, such as heavy fog, rain
and snow etc.
But the disadvantage is that the cost is too high, accounting for
more than 60% of the total cost of the entire uncooled products
production, and causing a long production cycle. Such packaging
method is for high-end applications.
