TWIN612 Thermal Imaging Module
Long Wave 640x512 12μm Thermal Imaging Module for Security
Monitoring
Product Description
TWIN612 thermal module is a new arrival product developed by Global
Sensor Technology. It integrates 640×512/12µm ceramic package
uncooled infrared detector. With typical NETD＜40mk, the TWIN612
thermal module could present clearer, sharper and more detailed
image.
With temperature measurement range of -20℃~150℃/0~550℃, accuracy of
±2℃ or ±2% and frame rate up to 30Hz, the thermal module guarantees
smooth thermal image and accurate temperature measurement.
The TWIN612 thermal module has the advantages of compact design,
light weight structure and power consumption as low as 0.8w. With
enhanced image algorithms and temperature measurement function, the
TWIN612 thermal module presents more stable images and accurate
temperature.
Ceramic packaging process is similar to metal packaging, which is a
mature infrared detector packaging technology. Compared with metal
packaging, the volume and weight of the packaged detector will be
greatly reduced. Thus, the TWIN612 thermal module could be applied
to industries that have strict requirements on size, weight and
power consumption.
Main Features
- Mini Size: 25.4mm×25.4mm×35mm
- Light Weight: 25g
- Typical NETD<40mk
- Sharp, Clear Thermal Imaging
- Typical Power Consumption as Low as 0.8W
Product Specifications
| Model | TWIN612/R |
| IR Detector Performance |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Range | 8~14μm |
| Typical NETD | ＜40mK |
| Image Processing |
| Frame Rate | 25Hz/30Hz |
| Start-up Time | 6s |
| Analog Video | PAL/NTSC |
| Digital Video | YUV/BT.656/LVDS/USB2.0 |
| Image Display | 11 in Total (White Hot/Lava/Ironbow/Aqua/Hot
Iron/Medical/Arctic/Rainbow1/Rainbow2/Red Hot/Black Hot) |
| Image Algorithm | NUC/3D/2D/DRC/EE |
| Electrical Specifications |
| Standard External Interface | 50pin_HRS |
| Communication Interface | RS232/USB2.0 |
| Supply Voltage | 4~5.5V |
| Typical Power Consumption | 0.8W |
| Temperature Measurement |
| Operating Temperature Range | -10℃~50℃ |
| Temperature Measurement Range | -20℃~150℃, 0℃~550℃ |
| Temperature Measurement Accuracy | Greater of ±2℃ or ±2% |
| SDK | Windows/Linux; Achieve Video Stream Analysis and Conversion from
Gray to Temperature |
| Physical Characteristics |
| Dimension (mm) | 25.4×25.4×35 (Without Lens) |
| Weight | 25g (Without Lens) |
| Environmental Adaptability |
| Operating Temperature | -40℃～+70℃ |
| Storage Temperature | -45℃～+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, 3 Axis |
| Shock | Half Sine Wave, 40g/11ms, 3 Axis, 6 Direction |
| Optics |
| Optional Lens | Fixed Athermal: 13mm |
Industrial Applications
The TWIN612/R thermal imaging module is applied to the field of
Thermography, Security Monitoring, UAV Payloads, Robots,
Intelligent Hardware, ADAS, Firefighting & Rescue
Our Advantages
FAQs
1.What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector
/ thermal imaging sensor is an optical-electrical device to react
to infrared radiation and thermal energy and convert it into
electrical signal and then output visible thermal images.
2.What is WLP?
WLP refers to wafer level package. It is the process of completing
high vacuum packaging directly on the entire MEMS wafer, then
scribing and cutting to make a single infrared sensor. Together
with metal package, ceramic package, they are the 3 main package
formats of uncooled infrared detectors.
3. What is the difference between wafe level package, ceramic
package and metal package?
Uncooled infrared detectors are currently divided into metal
packaging, ceramic packaging, and wafer-level packaging. Metal
packaging is the earliest and the best among the three main
packaging forms; wafer-level packaging is suitable for mass
production; and the ceramic packaging is more favored by the
dedicated market for civilian products.
