TIMO120 Thermal Camera Core
Miniature VOx FPA 120x90 / 17μm Thermal Imaging Camera Core
Integrated in Infrared Cameras
Product Description
TIMO120 miniature infrared module integrates wafer-level optics,
120x90 / 17μm wafer level package (WLP) detector and basic image
processing circuit to quickly obtain thermal images of the target
area and heat distribution.
TIMO120 thermal imaging core is oriented for optimized size,
weight, power, cost (SWaP-C) infrared imaging applications. Its
super miniature structure and ultralow power consumption are
convenient to be integrated into various smart devices, thermal
imagers or mobile terminals with strict requirements on cost, size
and weight.
Main Features
- Minimum WLP infrared module, dimension at 8.5x8.5x9.16mm
- DVP Interface, compatible with various embedded platforms
- Visible camera module equivalent, directly integration
- Complete SDK development kit
- Low power design for extend longer operating time
- Low cost for many kinds of intelligent applications
Product Specifications
| Model | TIMO-120 |
| IR Detector Performance |
| Resolution | 120x90 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | ≤60mK |
| Lens Type | WLO |
| Focus Mode | Fixed Zoom |
| HFOV | 90°/50° |
| Depth of Field | 10cm to Infinity |
| Frame Rate | 1~30Hz (Customizable) |
| Temperature Measurement |
| Temperature Range | -20°C ~ +120°C (Customizable) |
| Temperature Accuracy | Customizable (Meet the Requirements of Body or Industrial
Thermography) |
| Interface/Control |
| AVDD | 3.6V±0.05V |
| VSK/VDET | 4.7±0.05V |
| DVDD | 1.8V±0.05V |
| Interface | Digital Interface |
| Power Consumption | 45mW (Typical Mode); 9mW (Low Power Mode) |
| Physical Characteristics |
| Dimension (mm) | 12x10x5.48 (HFOV=90°); 8.5x8.5x9.16 (HFOV=50°) (The Specifications
Shall Prevail) |
| Operation Temperature | -20°C ~ +60°C |
| Storage Temperature | -40°C ~ +85°C |
Industrial Applications
The TIMO120 infrared thermal camera core is widely used in many
areas, such as Thermography, Intelligent Hardware, Smart Building,
Smart Home, AIoT etc.
Global Sensor Technology Team
FAQs
1. Thermal Image Vs. Visual Image
Visible light is an electromagnetic wave that can be seen by
humans. Its wavelength range generally falls between 360-400
nm~760-830nm. This electromagnetic spectrum is also called the
visible spectrum, and its frequency range is 830-750THz~395-360THz.
Infrared is an electromagnetic wave with a wavelength between
microwave and visible light. Its wavelength is between 760
nanometers (nm) and 1 millimeter (mm). It is an invisible light
with a wavelength longer than red light. The frequencies are
approximately in the range of 430 THz to 300 GHz.
2. Detector of Thermal Image & Visual Image
For the core detectors of imaging device, visible light devices use
the CCD and CMOS detector, while thermal imaging uses cooled and
uncooled detector. The main difference is that visible light
CCD/CMOS can perceive light waves in the visible light band, and
thermal imaging detectors can sense thermal radiation light waves
in the infrared band. Infrared thermal imaging detectors are
divided into many types according to different manufacturing
processes and packaging materials. The more macroscopic feeling is
that infrared thermal imaging detectors are more expensive than
visible light CCDs.
