PLUG1212 Infrared Camera Module
VOx Uncooled LWIR 1280x1024 / 12μm Thermal Camera Module for
Industrial Temperature Measurement
Product Description
PLUG1212R is one of the PLUG-R series uncooled infrared camera
module developed by Global Sensor Technology (GST). It adopts the
market preferred focal plane array VOx microbolometer uncooled
infrared detector, professional signal processing circuit and image
processing platform, completely transforms the target infrared
radiation into temperature data. Its temperature measurement is
available and temperature range can be customizable raging from
-20℃~150 ℃ for industrial temperature measurement.
With large array 1280x1024 resolution, the PLUG1212R uncooled
thermal module could present more image details and supports larger
field of view. The reduced 12µm pixel size offer better spatial
resolution and match shorter optical lens focus to achieve the same
range mission.
Main Features
- Pixel pitch: 12μm
- Resolution: 1280x1024
- Spectra Range: 8μm -14μm
- High Sensitivity: NETD<30mK
- Temperature Range: -20℃~150℃, 100℃~550℃
- Temperature Accuracy: ±2℃ or ±2%
- High reliability & Strong Environmental Adaptability.
Product Specifications
| Model | PLUG1212R |
| IR Detector Performance |
| Resolution | 1280x1024 |
| Pixel Pitch | 12μm |
| Spectral Range | 8~14μm |
| NETD | <30mk |
| Image Processing |
| Frame Rate | 25Hz |
| Start-up Time | <25s |
| Analog Video | / |
| Digital Video | HDMI/RAW/YUV/BT1120 |
| Extension Component | USB/Camerlink |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE |
| Electrical Specification |
| Standard External Interface | 50pin_HRS Interface |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 5±0.5V |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±2°C or ±2% (Take the Maximum Value) |
| SDK | ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 56x56x40.2 |
| Weight | ≤200g |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 19mm/25mm |
Industrial Applications
The PLU1212R infrared imaging module is widely used in Power
Electricity, Machine Vision, Building Inspection, Metallurgical
Petrochemical etc.
Our Core Infrared Detectors
FAQs
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a
mature infrared detector packaging technology. Compared with metal
packaging, the volume and weight of the packaged detector will be
greatly reduced. For ceramic packaging, its readout circuit has
self-adjusting operating temperature function and does not require
TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging,
has become an important part of advanced packaging technology in
the semiconductor industry. Wafer level packaging (WLP) is the
process of completing high vacuum packaging directly on the entire
MEMS wafer, then scribing and cutting to make a single infrared
detector. It performs most or all of the packaging and testing
procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small
size, lightweight, portable, handheld, low price and high
production efficiency.
