PLUG617R Uncooled Thermal Core
Infrared Thermal Camera Module Core 640x512 / 17μM For Industrial
Thermography
Product Description
PLUG617R uncooled thermal camera module consists of 640x512 / 17μm
uncooled fpa infrared detector, full series of optical components,
professional signal processing circuit and image processing
algorithm.
PLUG617R is a kind of uncooled camera module applied in the field
of industrial thermal imaging and temperature measurement. The
temperature range is customizable, which can meet the specific
requirements of industrial thermography and present a clear thermal
image.
As a leading thermal camera module manufacturers, Global Sensor
technology is committed to opening a new vision for industrial
temperature measurement. After years of technical accumulation and
practical experience in the field of infrared temperature
measurement, we have provided our customers a full range of machine
thermal imaging vision solutions.
Main Features
- NETD<30mk, High Sensitivity
- Stable Performance
- Easy Integration
- Clear Image Quality & Details
- Customizable Temperature Range
- Strong Environmental Adaptability
Product Specifications
| Model | PLUG617R |
| IR Detector Performance |
| Resolution | 640x512 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | <30mk |
| Image Processing |
| Frame Rate | 25Hz/30Hz |
| Start-up Time | <15s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656/LVDS |
| Extension Component | USB/Camerlink |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE |
| Electrical Specification |
| Standard External Interface | 50pin_HRS Interface |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 4~6V |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±2°C or ±2% (Take the Maximum Value) |
| SDK | ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 44.5x44.5x36.6 |
| Weight | <90g |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 7.5mm/13mm/19mm/25mm/35mm
Motorized Lens: 75mm/100mm/150mm |
Industrial Applications
The PLUG617R thermal imaging module is widely used in Electric
Power Inspection, Machine Vision, Building HVAC Security &
Monitoring, Outdoors, Firefighting & Rescue, Law Enforcement &
Rescue, ADAS, UAV Payloads etc.
Global Sensor Technology Team
FAQs
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a
mature infrared detector packaging technology. Compared with metal
packaging, the volume and weight of the packaged detector will be
greatly reduced. For ceramic packaging, its readout circuit has
self-adjusting operating temperature function and does not require
TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging,
has become an important part of advanced packaging technology in
the semiconductor industry. Wafer level packaging (WLP) is the
process of completing high vacuum packaging directly on the entire
MEMS wafer, then scribing and cutting to make a single infrared
detector. It performs most or all of the packaging and testing
procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small
size, lightweight, portable, handheld, low price and high
production efficiency.
